AMD Ryzen™ Embedded V1000 processor family Up to 32GB dual SODIMM socket DDR4 PCIe x16, PCIe x1, M.2 and Mini-PCIe expansion 4x DisplayPort
Low-profile Thin Mini-ITX Embedded board Intel VT-x/VT-d supported Up to 16GB non-ECC DDR3L memory at 1866/1600 MHz in dual stacked SODIMM socket Intel® Gen9 Low Power graphics, up to 4k resolution and H.265 codec DisplayPort, HDMI, dual channel 18/24-bit LVDS (eDP by build option), supports three independent displays Supports Smart Embedded Management Agent (SEMA) functions Extreme Rugged operating temperature: -40°C to +85°C (build option for selected SKUs)
6th/7th Gen Intel Core i7/i5/i3, Intel Pentium G4400/G4400TE and Celeron G3900/G3900TE Desktop Processor with Intel® Q170/H110 Chipsets Up to 32 GB dual channel DDR4 at 2133 MHz Intel Gen 9 graphics, 3x DP, LVDS co-lay with eDP (opt.) 1x PCIe x16 (Gen 3), 1x PCIe x1 (Gen 2), 1x full size Mini PCIe + USB or mSATA, 1x half size Mini PCIe + USB, 1x SPI header for external BIOS Q170: 7x USB 3.0, 4x USB 2.0; H110: 4x USB 3.0, 7x USB 2.0
6th/7th Gen Intel® Core™ i7/i5/i3 or Xeon E3 processors and C236 chipset Dual-channel DDR4 2133/2400 MHz memory up to 64 GB ECC or non-ECC in four DIMM slots PCIe 3.0 slot bifurcation supports up to 5x PCIe 3.0 expansion slots Rugged I/O design to enhance I/O port compatibility and reliability Total 5 PCIe slots, among as 4xPCIe 3.0 x4 lanes plus one 1xPCIe 3.0 x8 lane, 2xPCIe 3.0 x4 lanes plus 2xPCIe 3.0 x8 lanes, or 2xPCIe 3.0 x4 lanes plus 1xPCIe 3.0 x16 lane, and 2x PCI for Motion and I/O cards Unique power design to ensure stable USB power of 5V +-5% even USB full loading by 300W PSU, conversing TCO. Fully compatible with ADLINK's full spectrum of motion and I/O cards, and optimal system placement for motion/vision integrated solution. IEC 61000-4-2~6 (Performance Criterion A), CE/FCC class B certified
1x Intel® Xeon® D-2100 family processor 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB 2x 2.5” SATA bays and 2x M.2 M Key interfaces 420mm depth 1U 19” rackmount form factor Built-in Intel® QAT support TPM 1.2/2.0 modul 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications Verified for Intel® Select Solution for uCPE on CentOS
Up to 2x 1st or 2nd Gen Intel® Xeon® Scalable Processors 16x DDR4 2666 ECC REG memory up to 512GB 2x 2.5" SATA bays 3x M.2 interfaces on board 2x PCIe x16 Gen3 single/dual-slot FHFL interfaces TPM 1.2/ 2.0 module 2U 19’’ rackmount form factor, 420mm depth Validated as a NGC-Ready edge server and AWS IoT Greengrass edge device
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Mr Steven Pham: 0986 249 212