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This version of the ADP features the top tier QAM8295P. QAM8295P is the next generation Qualcomm® Snapdragon™ automotive infotainment module designed for superior performance and power efficiency. It has been developed as an SEooC (safety element out of context) targeting assumed ASIL B use cases. The key components of the QAM8295P module include SA8295P SoC, four instances of PMM8295AU power management IC, one third party power management IC, and two 556-ball LPDDR4X SDRAM.
SA8295P includes the following key components: Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology, Qualcomm® Adreno™ 695 GPU, Dual Qualcomm® Hexagon™ Tensor Processors, Qualcomm Spectra™ ISP 395, Adreno 665 VPU, Adreno DPU 1199, and dedicated Safety manager subsystem.

Key Features

• Features top tier SA8295P SoC
• Superior performance and power efficiency
• Dedicated Safety manager subsystem
• Display: Three DisplayPorts, one of them shared with USB 3.1, four 4-lane embedded DisplayPort v1.4b, two 4-lane MIPI DSI D-PHY v1.2
• Camera: Four 4-lane MIPI CSI configurable in 4 + 4 + 4 + 4 or split 2s configuration
• Audio: Six Class D Amplifier Analog OUT, four Analog/MIC Inputs, two A2B

 

Category Description
Processor Snapdragon™ SA8295P SIP
Qualcomm® Kryo™ 695 CPU built on Arm v8 Cortex technology
Qualcomm® Adreno™ 695 GPU for the highest in graphics performance and power efficiency
Dual Qualcomm® Hexagon™ Tensor Processors integrated with Qualcomm Hexagon DSP, quad Qualcomm Hexagon Vector eXtensions (HVX) processor, and dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors for high performance machine learning use cases Qualcomm® Spectra™ ISP 395 image processing engine
Adreno 665 VPU for high-quality, ultra HD video encode and decode
Adreno DPU 1199 for ultra HD multi-display support
Dedicated Safety Manager Subsystem equipped with dual ARC HS46 CPU in lock-step mode
Safety MCU 1x Aurix TC397XX
Memory Eight-channel high-speed memory – 2133 MHz LPDDR4X SDRAM with optional low-power features (8x 16-bit); 16 GB
Storage Two UFS 3.1 gear 4 – 2 lanes for on-board memory (UFS0 as boot up device); NVMe via PCIe (not-bootable)
Audio Six Class D Amplifier Analog OUT; Four Analog/MIC Inputs; Two A2B
Power Supply 6V to 20V DC, typical 12V DC
Camera Four 4-lane MIPI CSI configurable in 4 + 4 + 4 + 4 or split 2s configuration
Display Three DisplayPorts, one of them shared with USB 3.1
Four 4-lane embedded DisplayPort v1.4b
Two 4-lane MIPI DSI D-PHY v1.2
Connectivity Wi-Fi 6 (802.11ax) + Bluetooth 5.2 Dual MAC MIMO + MIMO (QCA6696)
Dual-band dual-MAC radios for concurrent 2×2 MIMO 2.4GHz + 2×2 MIMO 5GHz operation Combined simultaneous maximum PHY rate of 1774Mbps
1x 1000 BaseT1
2x 100 BaseT1
I/O 4x CAN-FD; 2x LIN
Sensors Gyro, Accelerometer - ASM330LHH; Magnetometer - AK09917D
Test and Debug JTAG: SoC, VIP; USB debug UARTs; Test automation
OS Support Linux Kernel v5.4, Yocto Project baseline 3.1

Specifications and features are subject to change without notice. Qualcomm Adreno, Qualcomm AI Engine, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Snapdragon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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