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Snapdragon Ride System-on-Chip Components

Major architectural blocks of both the SA8775P and SA8255P include:

Qualcomm Kryo Gen-6 CPU built on Arm V8.2 Cortex technology
Qualcomm Adreno 663 GPU for the highest in graphics performance and power efficiency as well as safe general-purpose (GP) GPU compute support
Qualcomm Hexagon Tensor Processor integrated with Qualcomm Hexagon DSP, quad Qualcomm Hexagon Vector eXtensions (HVX) processor, and dual Qualcomm Hexagon Matrix eXtensions (HMX) co-processors for high performance machine learning use cases.

The SA8775P Flex SoC:

The SA8775P is the next-generation Qualcomm Snapdragon Advanced Driver Assistance System (ADAS) and automotive infotainment SoC designed for superior performance and power efficiency in automotive applications. Designed with Safety Element Out of Context (SEooC), the SoC targets ASIL D use cases. Automotive Safety Integrity Level (ASIL) D is the highest rigor applied to safety assurance.

The SA8255P SoC: Automotive Infotainment

The SA8255P delivers next-generation Qualcomm Snapdragon automotive infotainment SoC designed for superior performance and power efficiency. Developed with SEooC targeting ASIL B use cases, the SAM8255P empowers automakers with scalable solutions that are connected, smart, and aware.
 

Category Description
Ride SX 4.0 FeatureSet Summary
Power +6 VDC to +20 VDC
+12 VDC typical
SoC Snapdragon Automotive SoC - available with SA8255P or SA8775P SoC
Storage Two 128 GB UFS 3.1
M.2 PCIe slot for optional NVMe SSD
Octal SPI NOR
USB Two USB 3.1 type A
One USB 2.0 type A
PCIe One PCIe Gen4 x2
One PCIe Gen4 x4
Cameras/video input Four mini-Quad FAKRA connect
Displays/video output Four DisplayPorts
Sensors One sensor card: GenX connector
GNSS Qualcomm® SiRFStar™ Location V
Audio Seven standard I2S
Three high speed I2S
AM / FM / DAB
Six channel line out
Four analog/mic inputs
Two ADI A2B master nodes
Wired networking RJ45 port connected to SafetyIsland Subsystem
RJ45 port connected to Vehicle Interface Processor (VIP)
Two RJ45 ports connected to SoC's SGMII ports
Six CAN-FD: SoC
Two CAN-FD: SoC – Partial Networking
Two CAN-FD: VIP – Partial Networking
Two LIN - VIP
Wireless Networking Wi-Fi and Bluetooth: Via add-oncard
Test and debug JTAG / SWD
UART
Test automation: Embedded ALPACA PSoC
Qualcomm SA8775P SoCand Qualcomm SA8255P SoC
Processor Quad Qualcomm® Kryo™ Kryo Gold Prime Cores
GPU Qualcomm®Adreno™ 663 GPU
DSP Qualcomm® Hexagon™ TensorProcessor integrated with Qualcomm Hexagon DSP
Quad Qualcomm Hexagon Vector eXtensions (HVX) processor
Dual Qualcomm Hexagon Matrix eXtensions (HMX) coprocessors
Safety Island (SAIL) Subsystem Dedicated Safety Island (SAIL) Subsystem equipped with quad Cortex-R52CPU
Multimedia Dual Adreno DPU1199
Two 4-lane MIPI-DSI
Four embedded DisplayPort (eDP) / DisplayPort v1.4
Camera Qualcomm Spectra 690 ISP
Four MIPI-CSI interfaces, configurable as D-PHY or C-PHY
Video Adreno VPU 670 for high-quality,ultra HD video encode and decode
Decode up to 4 x 4k60 or 4k240; AV1, HEVC, H.264, H.265, VP9, MPEG-2
Encode up to 2 x 4k60 or 4k120; HEVC, H.264 and H.265
Flash Via UFS: Two UFS 3.1
Via Octal-SPI/Quad-SPI: NOR flash (up to 166 MHz) as SAIL domain boot updevice
Via PCIe: NVMe (non-bootable)
Peripherals Two USB 3.1 and one USB2.0
One 2-lane and one 4-lane PCIe Gen4
Eight SAIL domain CAN-FD interfaces
Two SGMII 2.5 Gbps interfaces
One SAIL domain RGMII interface

Specifications and features are subject to change without notice. Qualcomm Adreno, Qualcomm AI Engine, Qualcomm Hexagon, Qualcomm Kryo, Qualcomm Snapdragon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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